Precision cutting of composite materials (polyimide film + thermosetting adhesive)
Simultaneous punching of polyimide films with adhesive, varying in size and thickness.
Polyimide boasts extremely high heat resistance and excellent mechanical properties, electrical insulation, and chemical resistance. It is used in applications such as insulating substrates for FPC in electronic components used in smartphones and camera modules. Myojo Electric has extensive know-how from years of experience in handling thermosetting resins, allowing us to add a peeling prevention process that is prone to occur during the processing of small-sized films. This enables us to simultaneously process polyimide films of various sizes and thicknesses with thermosetting adhesives applied, and we have a track record of large-volume production projects. Additionally, we can provide a consistent response from material procurement to bonding with supplied parts and after-curing, tailored to customer requests, so please feel free to contact us. 【Product Information】 - Various tape processing - Lamination processing - Thermal lamination - Bonding processing For more details, please contact us or download the catalog.